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publicationDate 2015-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2015064567-A1
titleOfInvention Silicon microstructuring method and microbattery
abstract A method for forming a rough silicon wafer including the successive steps of:n performing a plasma etching of a surface of the wafer in conditions suitable to obtain a rough structure, and performing two successive ion milling steps, one at an incidence in the range of 0 to 10°, the other at an incidence in the range of 40 to 60° relative to the normal to the wafer.
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