http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015053887-A1

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filingDate 2013-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e39ec3c1165e08edc2b6007826e62387
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publicationDate 2015-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2015053887-A1
titleOfInvention Polishing composition
abstract The polishing composition of the present invention is a polishing composition for polishing a tungsten-containing metal layer formed on an insulating layer, the polishing composition comprising: abrasive grains; one or more halogen acids selected from the group consisting of iodic acid, iodous acid, and hypoiodous acid; a strong acid; a hydrogen-ion-supplying agent; and water.
priorityDate 2012-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.