http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015053775-A1

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c63bc5ef3ae590b0603de4587961cac3
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B53-00
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C11-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-073
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-105
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-07
filingDate 2014-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a337bc848e9ad335a629201ceecead6
publicationDate 2015-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2015053775-A1
titleOfInvention Integrated circuit and manufacturing method thereof
abstract An integrated circuit and a manufacturing method thereof are provided. A chip size can be reduced by forming a memory device in which a ferroelectric capacitor region is laminated on a DRAM. The integrated circuit includes a cell array region having a capacitor, a peripheral circuit region, and a ferroelectric capacitor region being formed on an upper layer of the cell array region and the peripheral circuit region, and having a ferroelectric capacitor device.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016163359-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9990962-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10446560-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10410722-B2
priorityDate 2006-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 25.