| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bd12de0879498843f0f9d3d0a3959d57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6580bdbcebab0189b1f8ab0de6d1116 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D2202-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D133-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate |
2012-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3b7d35d5154ae0bab543f89899f2f47 |
| publicationDate |
2015-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015037588-A1 |
| titleOfInvention |
Photosensitive resin composition, cured product thereof, and printed wiring board |
| abstract |
Provided is a photosensitive resin composition which has excellent heat resistance, pore explosion resistance, empty foam resistance and crack resistance. A photosensitive resin composition of the present invention contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a diluent solvent, (D) a compound that has two or more ethylenically unsaturated groups in each molecule and (E) a thermosetting component that has two or more cyclic ether groups and/or cyclic thioether groups in each molecule. This photosensitive resin composition is characterized in that: (A-1) a carboxyl group-containing resin which is obtained by reacting an esterified product of an epoxy group, said esterified product being produced by reacting (a) at least one kind of a bisphenol type epoxy compound and (b) an unsaturated carboxylic acid, with (c) a saturated or unsaturated polybasic acid anhydride is contained as the carboxyl group-containing resin (A); and the thermosetting component (E) has an average epoxy equivalent weight of 200 or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113683732-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018340577-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11649334-B2 |
| priorityDate |
2012-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |