Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0348 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1148 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13109 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3157 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
filingDate |
2014-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5ea08ee7ccbf2a0f5c00eeb4f34f187 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de55e5dbb5121a61e24b5f32c1fa3c59 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_819b1e91cf932fcf818b77409e886e18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbbc132686ca0555a10d3a9149cbbb51 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0aa70a413b0bd7bfab7d70057ae2b525 |
publicationDate |
2015-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2015021777-A1 |
titleOfInvention |
Mounting structure and mounting structure manufacturing method |
abstract |
A mounting structure which reduces the mechanical stress added to a low-κ material due to warping caused by the difference in thermal expansion coefficients between a chip and a chip support during mounting. This mounting structure includes: a low-κ layer formed on top a semiconductor substrate; an electrode layer formed on the low-κ layer; a protective layer formed the low-κ layer and the electrode layer and having an opening reaching the electrode layer; a first solder layer filling the opening and formed on the electrode layer inside; a second solder layer formed on the first solder layer and having an elastic modulus smaller than the first solder layer; and a support layer connected to the second solder layer and supporting the semiconductor substrate. The protective layer has a greater elastic modulus and a smaller thermal expansion coefficient than an underfill layer formed between the protective layer and the support layer. |
priorityDate |
2013-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |