http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015016062-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-2029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20936
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
filingDate 2013-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a92a709c6b74ca9a734577bc474ee0d
publicationDate 2015-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2015016062-A1
titleOfInvention Highly integrated power electronic module assembly
abstract A power electronic module assembly according to an exemplary aspect of the present disclosure includes, among other things, a vapor chamber and a substrate integrated with a first surface of the vapor chamber. At least one cooling feature is integrated with a second surface of the vapor chamber.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10821832-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10591964-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018128257-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023046734-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10138880-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-3129267-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10345874-B1
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Total number of triples: 23.