| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7766e4b39b4e6176ffb38539a40edd2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a6a73440018eca5d3e92ae110c26dbb1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31522 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4215 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 |
| filingDate |
2011-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb468546319ebd165b49ea2b0d3c2b3e |
| publicationDate |
2014-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014342161-A1 |
| titleOfInvention |
Epoxy Resin Composition and Prepreg and Copper Clad Laminate Manufactured by Using the Same |
| abstract |
Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10696844-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115353825-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/AU-2016247084-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/AU-2016247084-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10544255-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10208156-B2 |
| priorityDate |
2011-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |