| abstract |
An object of the present invention is to provide a resin composition for adhesives, the resin composition mainly containing a resin that has a good adhesive strength or a good oxygen-barrier property, and an adhesive obtained by applying the resin composition onto a film. The object is achieved by providing a resin composition for adhesives, the resin composition containing (A) a resin that has, as functional groups, two or more hydroxyl groups per molecule, (B) an isocyanate compound that has, as functional groups, two or more isocyanate groups per molecule, and (C1) a plate-like inorganic compound or (C2) a light-blocking agent that can block light having a wavelength of 350 nm or less, and an adhesive obtained by curing the resin composition for adhesives. |