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filingDate 2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6be197286c14aee05b1b32061f74a1b
publicationDate 2014-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2014318973-A1
titleOfInvention Electrolytic copper foil and production method of electrolytic copper foil
abstract The present invention provides an electrolytic copper foil that has a high normal tensile strength, a low decrease in tensile strength after a thermal history, and a low concentration of impurities in the copper foil and a method for producing the copper foil. Specifically, the electrolytic copper foil in which a sulfur concentration of the copper foil is not less than 10 ppm by mass but no more than 50 ppm by mass, wherein when lattices with a spacing of 10 nm in a STEM image observed with a scanning transmission electron microscope at a magnification of 1 million times are formed and intersections of each lattice are used as a measurement point for determining a sulfur concentration, there is a measurement point at which the sulfur concentration is higher as compared to the sulfur concentration of the copper foil.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023243058-A1
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