http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014273437-A1

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publicationDate 2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2014273437-A1
titleOfInvention Subtractive plasma etching of a blanket layer of metal or metal alloy
abstract A method of forming at least one metal or metal alloy feature in an integrated circuit is provided. In one embodiment, the method includes providing a material stack including at least an etch mask located on a blanker layer of metal or metal alloy. Exposed portions of the blanket layer of metal or metal alloy that are not protected by the etch mask are removed utilizing an etch comprising a plasma that forms a polymeric compound and/or complex which protects a portion of the blanket layer of metal or metal alloy located directly beneath the etch mask during the etch.
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priorityDate 2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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