Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-019 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0018 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00158 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00 |
filingDate |
2013-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc5b578d743810adf3ab40cd255f96e4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16324cd6d036e417c1396242228171af |
publicationDate |
2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2014264653-A1 |
titleOfInvention |
MEMS Pressure Sensor and Microphone Devices Having Through-Vias and Methods of Forming Same |
abstract |
A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose the first membrane and a first surface of the second membrane to an ambient environment. A MEMS structure is formed in the MEMS wafer. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure and a second sealed cavity including a second surface of the second membrane for the pressure sensor device. The cap wafer comprises an interconnect structure. A through-via electrically connected to the interconnect structure is formed in the cap wafer. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017283247-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11205600-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10351419-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11203522-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11419995-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017016703-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10905356-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9650239-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10266400-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9554213-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11380597-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9981841-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9040334-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10508029-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9758369-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9902610-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102015206863-B3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017290527-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10519032-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10766763-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11097942-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9085455-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107848790-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9764948-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016340180-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11417576-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9181086-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11257727-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017313576-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107673303-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017355592-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107979800-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9260295-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9926190-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10981779-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107973267-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107682797-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015245146-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9544695-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9187317-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018111823-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106145028-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10961113-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9862600-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9604843-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016332865-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11600542-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10562760-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11670615-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9906869-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I691034-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10349187-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9850125-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11554226-B2 |
priorityDate |
2013-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |