| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 |
| filingDate |
2013-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd8ce6aa95a14b0603af39d212236a72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3df16406d855afabe58e6a048c2cdd2e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d8d9857c83aa2c37cd173389ae37529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c40feba9cf45c8cb6ec0e2c45cabfc80 |
| publicationDate |
2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014262797-A1 |
| titleOfInvention |
Electro Chemical Plating Process |
| abstract |
The present disclosure relates to an electro-chemical plating (ECP) process which utilizes a dummy electrode as a cathode to perform plating for sustained idle times to mitigate additive dissociation. The dummy electrode also allows for localized plating function to improve product gapfill, and decrease wafer non-uniformity. A wide range of electroplating recipes may be applied with this strategy, comprising current plating up to approximately 200 Amps, localized plating with a resolution of approximately 1 mm, and reverse plating to remove material from the dummy electrode accumulated during the dummy plating process and replenish ionic material within the electroplating solution. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111261585-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111074307-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017211199-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10041183-B2 |
| priorityDate |
2013-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |