| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f5a3a19402f63bea9ca2990b7ee75f02 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0207 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2013-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c3c2e1e70a12a833f37a2f44c5c8cf0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_635f2e0eb1184f27005d17a090a31648
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_921ecf4449391bd908de8bc9fb1988fd |
| publicationDate |
2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014262450-A1 |
| titleOfInvention |
Multilayer Printed Circuit Board Structure |
| abstract |
A multilayer printed circuit board structure is formed by stacking an aluminum foil substrate, a first pre-impregnated body, an aluminum foil middle layer, a second pre-impregnated body and a copper foil surface layer sequentially. Both the first pre-impregnated body and the second pre-impregnated body are composed by a fiber cloth impregnated with a heat conduction material in order that the heat conduction material can fill up the gaps of the fiber cloth. The heat conduction material is mixed from at least a resin and a filling material. |
| priorityDate |
2013-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |