| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C8-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C8-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C8-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C8-42 |
| filingDate |
2014-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b3dc79f67d62759c679258c526a2c98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74b01df98abc3d58462e7d2975de5b8f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15c841eb3115df575f3bb5445d919a13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21a50955c5a6f2382eb2e0d11ae90093 |
| publicationDate |
2014-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014251502-A1 |
| titleOfInvention |
Methods of Treating Metal Surfaces and Devices Formed Thereby |
| abstract |
Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11149202-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015287898-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9401466-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110527990-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11621105-B2 |
| priorityDate |
2010-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |