http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014225233-A1

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publicationDate 2014-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2014225233-A1
titleOfInvention Layer arrangement
abstract A layer arrangement in accordance with various embodiments may include: a wafer; a passivation disposed over the wafer; a protection layer disposed over at least a surface of the passivation facing away from the wafer; and a mask layer disposed over at least a surface of the protection layer facing away from the wafer, wherein the protection layer includes a material that is selectively etchable to a material of the passivation, and wherein the mask layer includes a material that is selectively etchable to the material of the protection layer.
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Total number of triples: 30.