| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b9812f5db4f0a5b582da641017acb7e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d75b470d355d5a5a23ca1d02a7535139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_78f95bc96fc6ba005a79fba8adcb3850
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f2a5e58063418b2fb690db9e955b671
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6173570296bc86d7c9536a42132a7bb9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 |
| filingDate |
2012-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6776c5770f0fbe6f8e2512cee8b54b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_137ea65fb4804ec17e2ba2db5a25b75c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c4d7e7a474776611f01aeef3491404a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47327d20fad9f77699ec62edc1e58387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_feed297891fc6f6f3f14e0817445ec35 |
| publicationDate |
2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014212582-A1 |
| titleOfInvention |
Curable resin compositions |
| abstract |
A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016288473-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015322315-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022153922-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110023294-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10975238-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10518512-B2 |
| priorityDate |
2011-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |