http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014199833-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2014-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e40db5e946ab757811e932831edecb5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e0adef551ae0f6cbb9ab67616909773 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14aa28892ae38c85607ea410606b63a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0197fa1e20e044443064dc8349d18069 |
| publicationDate | 2014-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2014199833-A1 |
| titleOfInvention | Methods for performing a via reveal etching process for forming through-silicon vias in a substrate |
| abstract | The present disclosure provides methods for via reveal etching process to form through-silicon vias (TSVs) in a substrate. In one embodiment, a method for performing a via reveal process to form through-silicon vias in a substrate includes providing a substrate having partial through-silicon vias formed from a first surface of the substrate into a processing chamber, wherein the partial through-silicon vias formed in the substrate are blind vias, supplying an etching gas mixture including at least a fluorine containing gas and a chlorine containing gas into the processing chamber, and preferentially removing a portion of the substrate from a second surface of the substrate to expose the through-silicon vias until a desired length of the through-silicon vias is exposed from the second surface of the substrate. |
| priorityDate | 2013-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.