Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bfd2c2f2bb0026db4d870cdf700616df |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H2001-0085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H7-1766 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H2001-0042 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3754 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G2-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H1-0007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-7195 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-08 |
filingDate |
2014-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d62c7035d8cc17105e272904d9371809 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdfd76006aaf254124dc2dc2753b1100 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ce4ba692109e61974b5f5edf8d0725b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03356eb41a09acdcd6558c8716b42307 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cadd1567c31e4b72d03ae734d32e7dd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32ef76cb2b862ad196fd4c4208da804c |
publicationDate |
2014-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2014194964-A1 |
titleOfInvention |
Low impedance oxide resistant grounded capacitor for an aimd |
abstract |
A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10923277-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11369800-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9579511-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11202916-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9138821-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021348253-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10204737-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10874865-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021051812-A1 |
priorityDate |
2008-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |