| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_625b73bb7af9b6b73e08cae5e30766bd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_29c0e1593120337b06294c5fb819fda2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3431786a7bd7e83a0f07edc3122f67ba |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2013-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f01c2f5c5e240fcf375ca83fe194f189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d92f34c837b8f984eb3fe75c26011c5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ef6c7746ad9a2d465abbbed9a74f92c |
| publicationDate |
2014-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014179833-A1 |
| titleOfInvention |
Epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same |
| abstract |
A epoxy resin composition includes an epoxy resin including repeat units represented by Formulae 1 and 2; a curing agent; a curing accelerator; and an inorganic filler, |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023032860-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018024734-A |
| priorityDate |
2012-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |