| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02277 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16 |
| filingDate |
2013-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d686aabd4a3a79889136eea92042225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2e1b11e5caa1d1294561307bf688a38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7535312ace812d59831a879fcfec0323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bbffe4dbef6680a385d52d61efa02e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65ddec8ae0a22c14bd416db16440ae74
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a0a335c982b4ff9dc6bf07a8a25ae62 |
| publicationDate |
2014-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014162194-A1 |
| titleOfInvention |
Conformal sacrificial film by low temperature chemical vapor deposition technique |
| abstract |
Methods and apparatus for forming a sacrificial during a novel process sequence of lithography and photoresist patterning are provided. In one embodiment, a method of processing a substrate having a resist material and an anti-reflective coating material thereon includes depositing an organic polymer layer over the surface of the substrate inside a process chamber using a CVD technique. The CVD technique includes flowing a monomer into a processing region of the process chamber, flowing an initiator into the processing region through one or more filament wires heated to a temperature between about 200° C. and about 450° C., and forming the organic polymer layer. In addition, the organic polymer layer is ashable and can be removed from the surface of the substrate when the resist material is removed from the surface of the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10943791-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9793108-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101905147-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9466325-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11626292-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018148832-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015017481-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020135487-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111128719-A |
| priorityDate |
2012-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |