http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014147995-A1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc744e119404fec0abdf375e51d1168d
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0254
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate 2013-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfe1e734e93742e446c0d67e8df4689b
publicationDate 2014-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2014147995-A1
titleOfInvention Method for producing p-type nitride semiconductor layer
abstract A method of manufacturing a p type nitride semiconductor layer doped with carbon in a highly reproducible manner with an increased productivity is provided. The method includes supplying an III-group material gas for a predetermined time period T 1 , supplying a V-group material gas containing a carbon source for a predetermined time period T 2 when a predetermined time period t 1 (t 1 +T 2 >T 1 ) elapses after the supply of the III-group material gas begins, repeating the step of supplying the III-group material gas and the step of supplying the V-group material gas when a predetermined time period t 2 (t 1 +T 2 −t 2 >T 1 ) elapses after the supply of the V-group material gas begins, and thus forming an Al x Ga 1-x N semiconductor layer (0<x≦1) at a growth temperature of 1190° C.˜1370° C. or a growth temperature at which a substrate temperature is 1070° C.˜1250° C. using a chemical vapor deposition method or a vacuum evaporation method. Nitrogen sites within the semiconductor layer are doped with carbon.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105720139-A
priorityDate 2012-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 21.