Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1f930201a54e8159231c89085f4a9fba http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ab185f976488ae19c7335a9a037b903 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b618a1cff94b223ec475ec4fdb87e9e1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_03404989695730b27522570bae09d679 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0141 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0305 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0272 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0214 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49162 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
filingDate |
2012-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b85e2731fbbbf2cacb1e3ccc575306c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cd92abc6f5d8c5f8589aebc4c3c305a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85cd0f2e1da42e89d8f13d09374e5ed8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a4e75d89dc4bbce314b968cfdc19fff |
publicationDate |
2014-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2014124250-A1 |
titleOfInvention |
Wiring board and method for manufacturing same |
abstract |
A wiring board includes an electric insulating base material including an incompressible member and a thermosetting member; a first wiring and a second wiring formed with the electric insulating base material interposed therebetween; and a via-hole conductor penetrating the electric insulating base material, and electrically connecting the first wiring and the second wiring to each other. The via-hole conductor includes a resin portion and a metal portion. The metal portion includes a first metal region mainly composed of Cu; a second metal region mainly composed of a Sn—Cu alloy; and a third metal region mainly composed of Bi. The second metal region is larger than the first metal region, and larger than the third metal region. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11581239-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019269010-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113275787-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10959327-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112616256-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10887988-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11083091-B2 |
priorityDate |
2011-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |