http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014118019-A1

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publicationDate 2014-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2014118019-A1
titleOfInvention Method of testing a semiconductor structure
abstract A method of testing a semiconductor structure is provided, including providing at least a semiconductor structure having an interposer and a semiconductor element disposed on the interposer; disposing the semiconductor structure on a carrier having a supporting portion, with the interposer being supported by the supporting portion; and performing a test process. The semiconductor structure has been tested for its electrical performance prior to packaging, thereby eliminating the necessity for a conductive pathway to pass through an inner circuit of an package substrate. Therefore, the testing process is accelerated and the time is save.
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Total number of triples: 24.