Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76825 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2013-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ee0780c3be5c2c9908ca8cfa480a270 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50c05e1481593cf7a7f31bbf076799e4 |
publicationDate |
2014-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2014113448-A1 |
titleOfInvention |
Positive photosensitive resin composition for spray coating and method for producing through electrode using the same |
abstract |
A method for producing a through electrode includes providing a semiconductor wafer having an integrated circuit provided on a surface of the semiconductor wafer and a hole provided in the semiconductor wafer along a thickness direction of the semiconductor wafer. At least a portion of a back surface of an electrode of the integrated circuit is exposed through the hole. A positive photosensitive resin composition is sprayed to form a coating film so that the coating film covers an inner surface of the hole. The positive photosensitive resin composition has a viscosity of 0.5 to 200 cP and includes an alkali-soluble resin, a compound which generates an acid when exposed to light, and a solvent. At least a portion of the coating film is exposed and developed to form a coating film pattern. |
priorityDate |
2008-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |