| abstract |
Disclosed herein is a photosensitive resin composition which comprises (A1) at least one compound selected from the group consisting of a silane compound represented by formula (I), a hydrolyzate thereof and a condensate of the hydrolyzate, (A2) a 1,2-quinonediazide compound, and (A3) an amino-based silane coupling agent represented by formula (II). A cured film prepared from the photosensitive resin composition has an excellent pattern development property, heat resistance and light transmittance, as well as an excellent adhesion property to a silicon nitride(SiNx) substrate, and it can be used as a protective film of an electronic component. |