| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fbfd4a011eb8265b54e6800d8f9750a8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e6042cf4fa66053edbcd4058677e81a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cebc9740ef706cde29e885504f274ffa |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2982
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1339
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 |
| filingDate |
2012-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c1c1b5d4d6a5cf48a7cea14cb617a46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4d3caecd8465c22778fc51bdf752940 |
| publicationDate |
2014-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014107295-A1 |
| titleOfInvention |
Epoxy resin composition, cured object and optical semiconductor sealing material |
| abstract |
An epoxy resin composition, a cured object thereof, and an optical semiconductor sealing material using the cured object are described. The epoxy resin composition includes an alicyclic epoxy resin (A) and a vinyl polymer particle (B). An acetone soluble part of the vinyl polymer particle (B) is 30 mass % or more. The mass average molecular weight of the acetone soluble part is 100,000 or more. The volume average primary particle diameter (Dv) is 200 nm or more. The epoxy resin composition is rapidly turned into a gel state by heating for a short time, and the transparency of the obtained cured object is good. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11225437-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10421688-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016046776-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016221873-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3263612-A1 |
| priorityDate |
2011-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |