| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fae4ca17beecc8aeabdb923a48968941
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_767e76490031249117bd44703f6d5a33 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76892
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K15-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df2c40973a69157c391994181ae98b6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_589f2360602d5cb83607bec1d70662c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5e7c3437843a8c86e096c3bfc39cb0e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9a1a4d80f05a6a14bcfc02c43a810dd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49f9dc30f46fd27931e996f494ced514
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dec5187266cab5512af92a174c1c3eb3 |
| publicationDate |
2014-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014097003-A1 |
| titleOfInvention |
Electrical components and methods and systems of manufacturing electrical components |
| abstract |
A method of manufacturing an electrical component includes providing a substrate, applying an insulating layer on the substrate, applying a circuit layer on the insulating layer, irradiating the insulating layer with an electron beam to transform the insulating layer, and irradiating the circuit layer with an electron beam to transform the circuit layer. The substrate may be a metallic substrate that is highly thermally conductive. The insulating layer provides electrical isolation and effective heat transfer between the circuit layer and the substrate. The method may include coupling a light emitting diode module or other active circuits requiring thermal management to the circuit layer resident on the electrically insulating/thermally conducting layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108141958-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3518279-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9937584-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017066342-A1 |
| priorityDate |
2012-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |