http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014087552-A1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 2013-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a90f71fab6dd0e86105cab80932d6bd
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publicationDate 2014-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2014087552-A1
titleOfInvention Method of forming a conductive polymer microstructure
abstract The present disclosure relates to microstructure devices, in which a conductive pattern is formed on the basis of a conductive polymer material. In order to avoid the deposition and processing of the sacrificial materials and reduce a negative influence of the lithography process on sensitive conductive polymer materials a one-layer patterning sequence is proposed, in which a trench pattern is formed in a dielectric material that is subsequently filled with the conductive polymer material.
priorityDate 2012-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 25.