http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014076842-A1

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filingDate 2013-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c05bb4fad643ae400b31b5dde601ada
publicationDate 2014-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2014076842-A1
titleOfInvention Dry etching method and device manufacturing method
abstract A dry etching method of etching a conductive material layered on a dielectric material, comprising: using a mixed gas including a halogen gas and an oxygen gas as an etching gas, a mixing ratio of the oxygen gas in the mixed gas being equal to or greater than 30% and equal to or less than 60%; setting a gas pressure in a chamber at a time of supplying the mixed gas into the chamber and generating plasma, within a range equal to or greater than 1 Pa and less than 5 Pa; and applying a bias voltage of frequency equal to or greater than 800 kHz and less than 4 MHz as a bias voltage to an etched material in which the conductive material is layered on the dielectric material, and performing etching, wherein the dielectric material is a ferroelectric material and the conductive material is a noble metal material.
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Total number of triples: 32.