Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_69529c59674f998de23c06cc2ec2d5aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ae5ec9ae0e51676c50c9dd104709386f http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9f80acb1e5f9480b0d2d11a31b3497da http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c810f3047f7d7acc340d6d4619462fcb http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13018 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02163 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0391 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05567 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13083 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K999-99 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 |
filingDate |
2012-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_744199a802cf14175b1c812c29c5f2e0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c48b45970ca3e8e9c213aea3b725fc9c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50ae201576d706bcb9ca3ee55bf2467c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5702a9b65592a59e1b3f24953d77c4e2 |
publicationDate |
2014-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2014070832-A1 |
titleOfInvention |
Interconnect assemblies with probed bond pads |
abstract |
An interconnect assembly includes a bond pad and an interconnect structure configured to electrically couple an electronic structure to the bond pad. The interconnect structure physically contacts areas of the bond pad that are located outside of a probe contact area that may have been damaged during testing. Insulating material covers the probe contact area and defines openings spaced apart from the probe contact area. The interconnect structure extends through the openings to contact the bond pad. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10879138-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10741460-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020395254-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11060182-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10134647-B2 |
priorityDate |
2012-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |