| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_56a86ba75475d56ee2e64dc0cd124940
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cadfe0f9dcf7b7835f81f54430b9fe6c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_48f76638440e7bb86a1f5840717273bd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T442-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T442-2926
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T442-2992 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F22-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L35-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-08 |
| filingDate |
2012-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_deda0080d9bdfec1865fa6c91f776b61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_028fd10841cb5414e60e09569900f19d |
| publicationDate |
2014-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014057086-A1 |
| titleOfInvention |
Halogen Free Thermoset Resin System for Low Dielectric Loss at High Frequency Applications |
| abstract |
The present disclosure provides a thermosetting resin composition including a polymaleimide prepolymer and a poly(arylene ether) prepolymer characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards, semiconductor devices and radome composites for aerospace applications. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10059841-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9902136-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018126699-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013252003-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10322565-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016280913-A1 |
| priorityDate |
2011-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |