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publicationDate 2014-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2014048857-A1
titleOfInvention Bulk fin-field effect transistors with well defined isolation
abstract A process fabricates a fin field-effect-transistor by implanting a dopant into an exposed portion of a semiconductor substrate within a cavity. The cavity is formed in a dielectric layer on the semiconductor substrate. The cavity exposes the portion of the semiconductor substrate within the cavity. A semiconductor layer is epitaxially grown within the cavity atop the dopant implanted exposed portion of the semiconductor substrate. A height of the cavity defines a height of the epitaxially grown semiconductor.
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