Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C27-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-089 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-122 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
filingDate |
2013-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17c72e78a19835fe6a3ec7387b9097fe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_664cd0cc3e1ceb77731aa367f265ee7a |
publicationDate |
2014-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2014023803-A1 |
titleOfInvention |
Airtight member and its production process |
abstract |
To provide a process for producing an airtight member, which can improve bonding property of a sealing layer to a highly thermally conductive substrate and reliability, in airtight sealing of a space between a glass substrate and a highly thermally conductive substrate by local heating by electromagnetic waves. n A glass substrate having a sealing material layer having electromagnetic wave absorbing property provided on a sealing region, and a highly thermally conductive substrate having a glass layer formed on a sealing region, are laminated while the sealing material layer and the glass layer are brought into contact with each other. The sealing material layer is irradiated with electromagnetic waves through the glass substrate to heat and melt the sealing material layer thereby to bond it to the glass layer, so as to form a sealing layer which airtightly seals the space between the glass substrate and the thermally conductive substrate. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109729669-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015198355-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9324967-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9410722-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108886026-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3860319-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10607904-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015028291-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110268516-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11254600-B2 |
priorityDate |
2011-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |