| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3e2273ceff2f65d533f2f4a79eca89eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e599ed4ff6831fdd1eeec06ef3e1704
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f7d1b55c7e1b2467b3fa0fba7e9ffc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_edac2edb05e09d4c70b731c41f011350
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2012-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30b46ea8afded799a7341e8d52dee228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19787c4eeb3515e995c63ce9fbbf04c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d86969fa33848c809e189f03b65e5444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b0fc88a34eea4e1b6d7d64e9772b2a5 |
| publicationDate |
2014-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014011905-A1 |
| titleOfInvention |
Novel polyamic acid, photosensitive resin composition, dry film and circuit board |
| abstract |
The present invention relates to novel polyamic acid; a photosensitive resin composition satisfying excellent flexibility and low stiffness and exhibiting excellent heat resistance and plating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014171590-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9326374-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9040604-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014224527-A1 |
| priorityDate |
2011-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |