| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f76aab74ed312003383a8600e2edbd5b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2013-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a8b4609d8c6978588b1455a12eb43ff |
| publicationDate |
2014-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014008822-A1 |
| titleOfInvention |
Liquid compression molding encapsulants |
| abstract |
Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019065208-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9281255-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015211215-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020037199-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020148881-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11198788-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015332984-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7031206-B2 |
| priorityDate |
2012-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |