Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_12d24c0a12c3ecdb6d9a47d623d96e76 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8484 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-40091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29339 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-84801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73263 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-371 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-40225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-84203 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-37 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-022 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
filingDate |
2013-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_239ca4da7ab888e8e86a6dc8636363e5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e0d3c559a7d58f98c18e054ab7812e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_796855c4fa0f73599178e26807d56b8a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8fbea964eb65497d79e9b0006519a62 |
publicationDate |
2014-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2014001636-A1 |
titleOfInvention |
Electronic component and method of manufacturing electronic component |
abstract |
Plating pre-processing is carried out before carrying out a plating process on the surface of a conducting section provided on a semiconductor wafer. A first metal film is formed on the surface of the conducting section by NiP alloy plating process. A second metal film is formed on the surface of the first metal film by immersion Ag plating process. The semiconductor wafer is diced and cut into semiconductor chips. A conductive composition containing Ag particles is applied to the surface of the second metal film which is on the front surface of the semiconductor chip. A bonding layer containing Ag particles is formed by sintering the conductive composition through heating. A metal plate is then bonded to the surface of the second metal film via the bonding layer containing Ag particles. The electronic component has high bonding strength, excellent thermal resistance and heat radiation properties. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017194279-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015144833-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11710718-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9633971-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10535626-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017047307-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11287107-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10892246-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10347415-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10347566-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10847614-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018351465-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I771564-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10886250-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023126663-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016240306-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9818713-B2 |
priorityDate |
2011-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |