http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013341736-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_62f941494409aea84f621977c5f0ab81 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0154 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00261 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00333 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0018 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate | 2012-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8d6659444d1825b7f77108d58d0b519 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78f6a98e4b4c09a6ee43e0eb8fa972c0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83fc80caddf13ff460b09e11b2f4b7c6 |
| publicationDate | 2013-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2013341736-A1 |
| titleOfInvention | Packaging Compatible Wafer Level Capping of MEMS Devices |
| abstract | This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20 μm×400 μm to 300 μm×400 μm have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques. Capacitive resonators packaged using this protocol have shown clean sensing electrodes and good functionality. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019169023-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11161737-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10584027-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9416003-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11512339-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015239733-A1 |
| priorityDate | 2011-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 103.