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filingDate 2013-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cc2f4c0c2ae88a92ad587e0ac0a06f7
publicationDate 2013-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2013337625-A1
titleOfInvention Method for manufacturing semiconductor device
abstract The present invention provides a method for manufacturing a semiconductor device including a metal compound film formation process based on an atomic layer deposition (ALD) with repeating a plurality of cycles in which a supply time of a metallic source gas at the first time of the cycles is longer than a supply time of the source gas at the second time or later of the cycles, the ALD including, as one cycle, supplying the metallic source gas to adsorb a metallic source onto a foundation; purging the metallic source gas from a film-forming space; supplying a reactant gas to convert the metallic source into a corresponding metal compound; and purging the reactant gas.
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priorityDate 2012-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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