| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2013-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccf9ccaf3031042ae7fc37a6ae2cc731
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4273282efd3b3f20dc0530b53f48501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1db4906f03cb7a84e0bc78873b9755d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0aec2b9c0f6ec5eb80baff255ed1f03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ede29555cb4b4e961bd3abb345187cb3 |
| publicationDate |
2013-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013319867-A1 |
| titleOfInvention |
Electrolytic copper plating solution and method of electrolytic copper plating |
| abstract |
An electrolytic copper plating solution is provided which has an excellent via filling ability without using formaldehyde, which is harmful to the environment. An electrolytic copper plating solution which contains compounds which have an —X—S—Y— structure wherein X and Y are individually atoms selected from a group comprising hydrogen, carbon, sulfur, nitrogen, and oxygen atoms and X and Y can be the same only when they are carbon atoms and specific nitrogen-containing compounds. Good filled vias can be made without causing a worsening of the exterior appearance of the plating by using this electrolytic copper plating solution. |
| priorityDate |
2012-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |