Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_05e41304d65467a6418a19c8b97efe94 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B41-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76876 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-40114 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2012-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66e8e4df03348f3c48903597cfe112bd |
publicationDate |
2013-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2013316531-A1 |
titleOfInvention |
Method for forming metal wire |
abstract |
Techniques for fabricating metal lines in semiconductor systems are disclosed. The metal may be tungsten. A hybrid Chemical Vapor Deposition (CVD)/Physical Vapor Deposition (PVD) process may be used. A layer of tungsten may be formed using CVD. This CVD layer may be formed over a barrier layer, such as, but not limited to, TiN or WN. This CVD layer may completely fill some feature such as a trench or via. Then, a layer of tungsten may be formed over the CVD layer using PVD. The layers of tungsten may then be etched to form a wire or line. Techniques for forming metal wires using a hybrid CVD/PVD process may provide for low resistivity with a barrier metal, low surface roughness, and good gap filling. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017309490-A1 |
priorityDate |
2012-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |