| abstract |
The present invention provides a polyamide resin composition not only having an appropriate melt viscosity despite addition of a conductive filler thereto but also having excellent moldability, conductivity, low-temperature impact resistance, and fuel barrier properties. The present invention is a polyamide resin composition containing specific amounts of a polyamide, a modified resin, and a conductive filler. The polyamide contains: dicarboxylic acid units containing 50 mol % or more of terephthalic acid units and/or naphthalenedicarboxylic acid units; and diamine units containing 60 mol % or more of aliphatic diamine units having 4 to 18 carbon atoms, and has terminal amino groups in an amount of 5 to 60 μmol/g. The modified resin has been modified with an unsaturated compound having a carboxyl group and/or an acid anhydride group. In the polyamide resin composition, a difference between the number of moles (M I ) of the terminal amino groups of the polyamide and the number of moles (M II ) of the carboxyl groups and the acid anhydride groups of the modified resin in 1 g in total of the polyamide and the modified resin is −5.0 μmol or more and less than 4.0 μmol, and the number of moles (M II ) is more than 4.0 μmol. |