| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a7b097bfd3f350ed27ffa53e1f114d1a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1403
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11845
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-119
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2013-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d9c13473ac5917e3c25ba0b0f5c9984
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d30c68bda9f2163e724a7d015d9e364a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ecc119034608137456b9b85e1b1fc0d |
| publicationDate |
2013-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013256880-A1 |
| titleOfInvention |
Electrode body, wiring substrate, and semiconductor device |
| abstract |
An electrode body is provided as an electrode body capable of appropriately reducing a load when silicon wafer direct bonding is performed. The electrode body includes a base member that has a predetermined thickness; and an electrode portion that is formed on one surface of the base member in a thickness direction thereof. The electrode portion includes a basic bump formed in a substantially columnar shape to protrude on the base member and a fragile bump formed independently from the basic bump to form a metallic bond with the basic bump. |
| priorityDate |
2012-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |