| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2012-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d75845dd33804277d0a3c0c684ca0dfc |
| publicationDate |
2013-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013187100-A1 |
| titleOfInvention |
Polymer thick film solder alloy conductor composition |
| abstract |
The invention is directed to a polymer thick film composition comprising solder alloy powder and organic medium comprising organic polymeric binder and solvent. The composition may be processed at a time and temperature necessary to remove all solvent. The invention is further directed to method(s) of electrode formation on circuits using such compositions and to articles formed from such methods and/or compositions. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014018482-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017027496-A3 |
| priorityDate |
2012-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |