| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a1c272af4f00c4142d937189c3322726
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f7f120efe096284c7389702c969cf3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9c900a600776ea8fcebd384194afecb6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09136 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2011-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf0c7fe5503bf18087db819f456998a8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0109d6bae84a427904dddb20cbde692 |
| publicationDate |
2013-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013180767-A1 |
| titleOfInvention |
Method of production of multilayer circuit board |
| abstract |
A method of production of a multilayer circuit board comprising using a curable composition which contains a heat curable resin and curing agent (I) to form an uncured or semicured resin layer on a board (step A), then bringing a curing agent (II) able to substantially to cure the heat curable resin at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin into contact with the surface of the resin layer, then heating the resin layer at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin and the curing agent (II) can substantially cure the heat curable resin (step B), next heating and curing the resin layer at a temperature at which the curing agent (I) can substantially cure the heat curable resin to form an electrical insulating layer (step C). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11398587-B2 |
| priorityDate |
2010-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |