| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b051f9f7933c758e66f6ceda5c9fb2cc |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2013-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e1df907c4b2011a56b2fa7b260d865e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7448a0d6cf27536a7fc79f6e858e1d8a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c116625080f53260518ac13920f812e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_437598c838d7daec36fb1b6657ab7448
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cb166d6ba9af61f01ef550e1794607d |
| publicationDate |
2013-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013178065-A1 |
| titleOfInvention |
Method and Composition for Chemical Mechanical Planarization of a Metal |
| abstract |
A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low within a wafer non-uniformity values and low residue levels remaining after polishing. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016083650-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015206801-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8956974-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014004698-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9809746-B2 |
| priorityDate |
2008-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |