http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013168613-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1b7a5c546db0678dbd6f9594fc43f2d6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7016a64eac3e41220f4f59ca37d6d6a9 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 |
| filingDate | 2011-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6341945b487a6d397f316c97b88d4ff3 |
| publicationDate | 2013-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2013168613-A1 |
| titleOfInvention | High impact strength conductive adhesives |
| abstract | The high impact strength conductive adhesive is a mixture formed from a bisphenol A-based epoxy resin, a curing agent, and silver flakes. In one embodiment, the bisphenol A-based epoxy resin forms about 10.5 wt % of the mixture and the curing agent forms about 14.5 wt % of the mixture, the balance being silver flakes. In this embodiment, the curing agent is preferably an oligomeric polyamine curing agent, such as amidoamine-polyoxypropylenediamine t-butyl phenol. Each silver flake preferably has a tap density of between about 4.0 g/cm 3 and about 5.8 g/cm 3 , and a surface area of between about 0.8 m 2 /g and about 0.3 m 2 /g. In an alternative embodiment, the bisphenol A-based epoxy resin forms about 11.7 wt % of the mixture and the curing agent forms about 16.3 wt % of the mixture, the balance being silver flakes. |
| priorityDate | 2011-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.