| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c578702b6c93d1dd3b2faf5e3affac55 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0266 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4673
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate |
2011-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62d1ce787c74722f66e26e975b2d8b28 |
| publicationDate |
2013-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013153279-A1 |
| titleOfInvention |
Wiring board and mounting structure thereof |
| abstract |
A wiring board according to an embodiment includes an inorganic insulating layer provided with a via-hole which is a penetrating hole, and a via-conductor which is a penetrating conductor disposed inside the via-hole. The inorganic insulating layer includes first inorganic insulating particles connected to each other and second inorganic insulating particles that are larger in particle size than the first inorganic insulating particles and are connected to each other via the first inorganic insulating particles, and also has, at an inner wall of the via-hole V, a protrusion including at least part of the second inorganic insulating particle. The protrusion is covered with the via-conductor. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018206347-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9157932-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11069643-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016242287-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10440823-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013169305-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9877390-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11057996-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9877387-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10524366-B2 |
| priorityDate |
2010-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |