abstract |
Provided is a substrate processing apparatus capable of increasing a conductance of an exhaust system while preventing or suppressing an increase in footprint of an apparatus, thereby reducing a pressure thereof. The substrate processing apparatus includes a process container ( 203 ) configured to accommodate a plurality of substrates ( 200 ) stacked together, process gas supply units ( 232 a, 232 b, 249 a, and 249 b ) configured to supply process gases for processing the plurality of substrates ( 200 ) into the process container ( 203 ), and an exhaust unit ( 300 ) configured to exhaust the process container ( 203 ). The exhaust unit ( 300 ) includes a vacuum pump ( 246 ), and exhaust pipes configured to connect the process container ( 203 ) and the vacuum pump ( 246 ). At least a portion of the exhaust pipes has a rib structure ( 370 ), and includes pipes ( 331 to 333 ) in which cross-sections perpendicular to an exhaust direction have a rectangular or oval shape. |