| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_523cc4b67206abc32c3105d97dd80b64 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1339
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
| filingDate |
2012-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c579a76d1ddf4e1dfa9ccab27b5d0602 |
| publicationDate |
2013-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013135800-A1 |
| titleOfInvention |
Package structure of electronic modules with silicone sealing frame |
| abstract |
A side package structure of electronic modules includes a upper substrate, a lower substrate and a sealing frame. The sealing frame is disposed between the upper substrate and the lower substrate to form a space thereof. The sealing frame is made of silicone to improve moisture barrier and to retard the permeation of water vapor. Also, the erosion of polar solvent and plasticizer is avoided due to the characteristic of the silicone. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017177731-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103992749-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11196052-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3739382-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019057058-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11415837-B2 |
| priorityDate |
2010-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |