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filingDate 2011-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1ea8618527e2665ddd24f5b12a35d22
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publicationDate 2013-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2013135184-A1
titleOfInvention Encapsulated arrays of electromechanical systems devices
abstract This disclosure provides systems, methods and apparatus for encapsulating electromechanical systems devices. In one aspect, large arrays of electromechanical systems devices can be encapsulated. In one aspect the encapsulation includes an encapsulation layer supported over the electromechanical systems devices by encapsulation layer supports. The encapsulation layer can also include a plurality of orifices. The orifices can be sealed such that the electromechanical systems devices below are not damaged.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017183221-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106132868-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11747934-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021405806-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10280073-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017501892-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015122951-A3
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